20-24 September 2021
US/Pacific timezone

Thermal core usage challenges in Android

22 Sep 2021, 08:35
20m
Microconference3/Virtual-Room (LPC Virtual)

Microconference3/Virtual-Room

LPC Virtual

150
Android MC Android MC

Speaker

Wei Wang (Google LLC)

Description

The Android community has been using thermal core infrastructure for both Tj and Tskin solutions for years, and many thermal DVFS features from various Vendors/OEMs are built upon this, which usually require changes in the thermal governor and framework. However, with GKI introduced, it is now forbidden for OEM to put a custom thermal governor as a module which limits the solution and sometimes leads to sub-optimal code which combines an in-driver governor. In addition, there are many learnings from use of the thermal core infrastructure for both Tskin and Tj solutions together, especially on the way they interact with each other. This talk will describe those problems in more detail and discuss potential solutions and improvements to the current situation.

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Primary author

Wei Wang (Google LLC)

Presentation Materials